Ultra-high pixel CoaXPress camera for semiconductors
High-precision detection of defects in semiconductor wafers. Contributes to improved production efficiency.
In the semiconductor industry, it is essential to accurately detect minute defects in wafers and substrates to ensure product quality. Particularly, with the advancement of manufacturing processes, the size of defects is becoming increasingly smaller, which may be overlooked by conventional inspection methods. Our ultra-high pixel CoaXPress camera detects fine defects with high precision due to its wide field of view and ultra-high-resolution imaging capabilities. This enables the prevention of defective products from being released and improves yield. [Application Scenarios] - Defect inspection of semiconductor wafers - Foreign matter inspection of substrates - Appearance inspection of electronic components [Effects of Implementation] - Improved detection accuracy of minute defects - Prevention of defective products from being released - Increased yield
- Company：CIS corporation
- Price：Other
